[1] | A.C. Diebold, “Overview of metrology requirements based on the 1994 National Technology Roadmap for semiconductor”. Advanced Semiconductor Manufacturing Conference and Workshop 1995, ASMC 95 Proceedings. IEEE/SEMI 1995, November 1995, pp. 50–60. |
[2] | J.R. Moyne. “Making the move to fab-wide APC”, Solid State Technology, vol. 47, no. 9, September 2004, pp. 47-52. |
[3] | S. J. Qin, G. Cherry, R. Good, J. Wang and C. A. Harrison. “Semiconductor manufacturing process control and monitoring: A fab-wide framework”. Journal Process Control, vol. 16, no. 3, 2006, pp. 179–191. |
[4] | Y.-J. Chang, Y. Kang, C.-L. Hsu, C.-T. Chang and T. Y. Chan. “Virtual Metrology Technique for Semiconductor Manufacturing”, Proceedings of the Conference on Neural Networks, Sheraton Vancouver Wall Center Hotel, 2006, pp. 5289–5293. |
[5] | P. H. Chen, S. WU, J. Lin, F. Ko, H. Lo, J. Wang, C. H. Yu, and M. S. Liang. “Virtual Metrology: A solution for wafer to wafer advanced process control”, Proceedings of the IEEE International Symposium on Semiconductor Manufacturing, September 2005, pp.155–157. |
[6] | F.-T. Cheng. “Researching Strategy and Development Proposal of e-Manufacturing”. Automation Division of National Science Council, Taiwan, R.O.C, October 2004. |
[7] | F.-T. Cheng, H.-C. Huang, and W.-M. Wu “Dual-Phase Virtual Metrology Scheme”, IEEE Transactions on Semiconductor Manufacturing, vol. 20, no. 4, November 2007, pp. 566–571. |
[8] | M.-H. Hung, T.-H. Lin, P.H. Chen and R.-C. Lin. “A novel virtual metrology scheme for predicting CVD thickness in semiconductor manufacturing”, IEEE/ASME Transactions on Mechatronics, vol. 12, no. 3, June 2007, pp. 364–375. |
[9] | A.A. Khan, J.R. Moyne and D.M. Tilbury. “An Approach for factory-wide control utilizing virtual metrology”, IEEE Transactions on semiconductor Manufacturing, vol. 20, no. 4, November 2007, pp. 364–375. |
[10] | T.-H. Lin, M.-H. Hung, R.-C. Lin and F.-T. Cheng. “A virtual metrology scheme for predicting CVD thickness in semiconductor manufacturing”. Proceedings of the 2006 IEEE International Conference on Robotics and Automation, May 2006, pp. 1054–1059. |
[11] | Y.-C. Su, T.-H. Lin, F.-T. Cheng, and W.-M. Wu. “Accuracy and Real-Time Considerations for Implementing Various Virtual Metrology Algorithms”. IEEE Transactions on Semiconductor Manufacturing, n. 21, vol. 3, August 2008, pp. 426–434. |
[12] | T. Kourti, “Application of latent variable methods to process control and multivariate statistical process control in industry,” Int. J. Adapt. Contr. Signal Process, vol. 19, no. 4, 2005, pp. 213–246. |
[13] | M. Tenenhaus, La Régression PLS Théorie et Pratique, Editions Technip, Paris, 1998. |
[14] | L. Györfi, M. Kohler, A. Krzyzak, and H. Walk, A Distribution Free Theory of Nonparametric Regression, Springer-Verlag, New York 2002. |
[15] | R.W.Kennard and L.Stone. “Computer Aided Design of Experiments”, Technometrics, no. 11, 1969, p.137-148. |
[16] | G. Dreyfus. Neural Networks Methodology and Applications. Hardcover, 2002. |
[17] | S. P. Muranka, M. Eizenberg, A.K. Sinha. Interlayers Dielectrics for Semiconductor Technologies, Elsevier edition, 2003. |
[18] | S. Chen, S. A. Billings, and W. Luo. “Orthogonal least squares methods and their application to non-linear system identification”, International Journal of Control, vol. 50, no. 5, 1989, pp. 1873 – 1896. |
[19] | A. C. Rencher, Methods of multivariate Analysis, Hardcover 2002. |
[20] | M. Stone, “Cross-validatory choice and assessment of statistical predictions”, Journal of the Royal Statistical Society, B 36, 1974, pp 111-147. |
[21] | B. Efron and R.J. Tibshirani. ”Improvements on cross -validation: The bootstrap method“, Journal of the American Statistical Association, vol. 92, 1997,pp.548-560. |
[22] | L. Breiman, “Arcing classifiers”, The Annals of Statistics, vol. 26, no.3, 1998, pp. 801-849. |
[23] | J. R. Quinlan, C4.5: Programs for Machine Learning, Morgan Kaufmann, 1993. |
[24] | J. H. Friedman and P. Hall. ” , Journal of Statistical Planning and Inference, vol. 137, no.3, March 2007, 669 – 683. |
[25] | D. Zeng and C. J. Spanos. “Virtual Metrology Modeling for Plasma Etch Operations” IEEE Transactions on Semiconductor Manufacturing, n. 4, vol. 22, November 2009, pp. 419–431. |
[26] | C-A. Kao, F-T. Cheng, W-M. Wu. “Preliminary study of Run-to-Run Control utilizing Virtual Metrology with Reliance Index”, IEEE Conference on Automation science and Engineering, 2011, Trieste, Italy |
[27] | F. T. Cheng, J. Chang, H. Huang, C. Kao, Y. Chen, and J. Peng. “Benefit model of virtual metrology and integrating AVM into MES.” IEEE Transactions on Semiconductor Manufacturing, 24(2):261-272, 2011 |
[28] | B. S. Gill, T. F. Edgar, and J. D. Stuber. “A novel approach to virtual metrology using Kalman Filtering.” Future Fab International, 35:86-91, 2010 |
[29] | P. Kang, H. J. Lee, S. Cho, D. Kim, J. Park, C. K. Park, and S. Doh. “A virtual metrology system for semiconductor manufacturing.” Expert Systems with Applications, 36(10):12554-12561, 2009 |
[30] | C. Shan, P. Tianhong, and J. ShiShang. “Development of a virtual metrology for high-mix TFT-LCD manufacturing processes.” Journal of Semiconductors, 31(11):116006/1-116006/5, 2010 |
[31] | E. Ragnoli, S. McLoone, S. Lynn, J. Ringwood and N.Macgearailt. “Identifying key process characteristics and predicting Etch Rate from High Dimensionality Datasets” Proc. IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC), Berlin, 2009 |